Technical Conference
Tracks
- Product Design and Development
- Assembly and SMT
- PCB Fabrication, Materials and Design
- Quality and Reliability
- Fab and Silicon
- Test
- Equipment, Tools, and Modules
- Packaging and Substrates
- Mechanics
- Thermals
- Electrical
- Materials
- Industry Analysis and Issues
The IPC ESTC program boasts a rich selection of presentations in each of the areas of specialized design, packaging, assembly or surface mount. Choose from 13 tracks of technical conference paper sessions. Register by May 10 and save $100 on the technical conference. Exhibit Hall Access included with each conference registration.
Tuesday, May 21
TRACK
Electrical
8:30 am–9:30 am
High Speed Circuits and Systems
Chairs: Vikram Sekar, Peregrine Semiconductor; Ozgur Misman, Amkor Technology
-
Consideration of Fiber Weave Impacts in Selecting PCB Dielectric Material for 28 Gbps SerDes Applications
Gnanadeep Kollipara, Rambus, Inc. - System Design of a Bufferless 6.4 Gbps Server Multi-DIMM Memory Solution
Yi, Rambus, Inc.
TRACK
Industry Analysis and Issues
Materials
10:00 am–11:30 am
Industry Issues and Analyses
Chair: Dan Tracy, Semi
- Electronics Manufacturing Service Industry in China: Current Issues and Future Trend Outlook
Wei Koh, Pacrim Technology - TSV Process Technologies and Implications for Advanced Materials
Mike Corbett, Linx Consulting - On-Shoring in the Electronics Industry: Findings from an IPC Study
Sharon Starr, IPC
TRACK
Assembly and SMT
10:00 am–12:00 pm
Assembly and SMT I
Chairs: Ming Li, Rambus; Reza Sharifi, Broadcom Corporation
- An Initial Investigation into the Employment of Plasma Technology for Treating Mold Release and Flux Residues on Printed Circuit Board Assemblies Prior to Selective Conformal Coating
David Foote, Nordson MARCH - The Implications of Recent Technology for X-Ray Inspection in Electronics
Dr. Evstatin Krastev, Nordson DAGE - Voids Free Multiple-Layer Dot Jetting of Ambient Curable Fluid
Dr. Hanzhuang Liang, Nordson Asymtek - Non-Aqueous Halide-Free Chemistry at Copper and Tin Interfaces
John Flake, Louisiana State University
TRACK
Electrical
10:00 am–11:30 am
Power Distribution and Modeling
Chairs: Aswani Kurra, LSI Corporation; Jiming Song, Iowa State University
- Core Power Delivery Network (PDN) Analysis and Comparison of Core vs. Coreless Substrate in a Multilayer Organic Buildup Package
Ozgur Misman, Amkor Technology - Effective Media Model and Experimental Verification for Multilayer Dielectric Slabs Embedded with Periodic Metal Structure
Teng Zhao, Iowa State University - Modeling Challenge and Solutions on System Level Power Delivery System Analysis and Design
Jin Zhao, Intel
TRACK
Assembly and SMT
2:00 pm–4:00 pm
Assembly and SMT II
Chairs: Ming Li, Rambus, Inc.; Reza Sharifi, Broadcom Corporation
- Automatic Detection of Die Cracks in Bare Die Units Using Image Analysis
Asaad Said, Intel - A Systems Approach for Assigning a Reflow Profile Recipe to Printed Circuit Board Assembly Clusters Based on Attributes
Ganesh Pandiarajan, Research Foundation SUNY - Flipchip eWLB (embedded wafer level ball grid array) Technology as Innovative 2.5D Packaging Solutions
Seung Uk Yoon, STATS ChipPAC, Ltd.; presented by Patrick Tang - Proven Strategies to Minimize Voiding Under QFNs and Other Bottom Termination Components
Brook Sandy-Smith, Indium Corporation
Wednesday, May 22
TRACK
Product Design and Development
Thermals
8:30 am–9:30 am
Thermal Modeling and Experimental Methods
Chair: Moses Chan, Vitesse Semiconductor
- Effect of Thermal Properties of Die Attach Materials on Performance of High Power Blue LEDs
Ravidra Bhatkal, Alpha, an Alent PLC Company - Data Center Improved Efficiency & Reliability Using Immersion Cooling
Cheryl Tulkoff, DfR Solutions
TRACK
Quality and Reliability
8:30 am–12:00 pm
Reliability Assessment of Electronic Systems
Chair: Ed Tinsley, Dell, Inc.
- Reliability Assessment of Cu Bonding Wire in Semiconductor Packages for Communication Devices
Hong Yang, Entropic Communications - Respond to Demands for Increased Electronics Reliability with Advanced HALT/HASS Applications
Neill Doertenbach, Qualmark - Guide in Writing a Master Quality Plan
Yu Jin, Lenovo - Package Current Carrying Capability Evaluation Methodology
Mohammad Hossain, Intel - How to Improve LED Lifetime Assessment Method
Diganta Das, CALCE, University of Maryland - Use Condition/Customer Test Envelope Based BGA Shock Reliability Development
Vijay Kulkarni, Intel
TRACK
PCB Fabrication, Materials and Design
Product Design and Development
10:00 am–11:30 am
System Solutions
Chairs: Nozad Karim, Amkor Technology; Clarisse Mazuir, Philips Lumileds Lighting
- Making IC Prototyping and Production Less Risky and More Affordable
Teddy O’Connell, The MOSIS Service - Application of fcCuBETM Technology to Enable Next Generation Consumer Devices
Islam Mohd, STATS ChipPAC Co., Ltd. - Investigation of Harmonic Vibration Loading on Package on Package Assemblies
Nikhil Lakhkar, Cascade Engineering Services
TRACK
Quality and Reliablility
2:00 pm–4:00 pm
Package Interconnect Reliability
Chair: Steve Restivo, Lenovo
- Bond Via Array — A New Ultra-fine Pitch Package on Package Solution for High Bandwidth Mobile Applications
Zhijun Zhao, Invensas Corporation - The Study of Vibrational Performance of Long Term Isothermally Aged SAC Alloys
Namo Pankaj Vijayakumar, Auburn University - Reliability Assessment of an Electronic Assembly with a Large Number of Ball Grid Array Packages and Interconnects
Jingsong Xie, RelEng Technologies, Inc. - The Effect of Solder Composition on Vibration Durability of Ball Grid Array Assemblies
Sandeep Menon, CALCE, University of Maryland
TRACK
Product Design and Development
2:00 pm–4:00 pm
System Integration
Chairs: Clarisse Mazuir, Philips Lumileds Lighting; Nozad Karim, Amkor Technology
- 3-D and Multichip Packaging Enables Secure Data Communication
Phil Marcoux, PPM Associates - FMEA of FMEAs
Michael Silverman, Ops A La Carte - Development of a High Speed Switch Using the FusionQuad Package — Design, Reliability and Application Considerations
Moses Chan, Vitesse Semiconductor - Miniaturization Design for Smart Phone
Young Liu, Lenovo
TRACK
Materials
Product Design and Development
2:00 pm–5:00 pm
Materials for Advanced Packaging
Chairs: Prameela Susarla, Dow Chemical; Joseph Ritter, JSR Micro, Inc.
- Low Cost BT Organic Material for Wireless 60 GHz Application
Pouya Talebbeydokhti, Intel - New BT Material for High Frequency IC Package
Michio Yaginuma, Mitsubishi Gas Chemical - Optimization of the Flip Chip Package with the Low-k Dielectric Materials
Raman Thiagarajan, University of Texas, Arlington - Understanding Nanocoating Technology
Cheryl Tulkoff, DfR Solutions - Build-up Electrical Insulation Material for IC Packages Requiring High Speed & High Frequency
Eita Horiki, Sekisui Chemical Co., Ltd.
Thursday, May 23
TRACK
Mechanics
Quality and Reliability
8:30 am–12:00 pm
Package Mechanics Simulation and Prediction
Chairs: Nozad Karim, Amkor Technology; Clarisse Mazuir, Philips Lumileds Lighting
- Fracture Predictions Using Peridynamics with Application in Electronic Packages
Abigail Agwai, University of Arizona - Warpage Optimization Study on a Large-Sized LFBGA
Ming-Che Hsieh, STATS Chip PAC - TC Requirements
Ru Han, Intel - Comparison of Germanium and Phosphorous Added Lead-Free Solder Ball
Dr. Ming Sun, Broadcom
TRACK
Assembly and SMT
Mechanics
PCB Fabrication, Materials and Design
Quality and Reliability
10:00 am–11:30 am
2.5/3D Integration Technologies
Chair: Michael Flint, U.S. Department of Defense
- Integration of Temporary and Hybrid Permanent Bonding Process Flows for 3-D Integration
Sumant Sood, SUSS MicroTec, Inc. - Method for Selecting Optimal 3-D IC Technology for Multi-Functional System-On-Chip Devices
Makoto Motoyoshi, Tohoku-MicroTec Co. - 3-D Si Interposer Manufacturing and Design Challenges
Ming Li, Rambus, Inc.