IPC ESTC Program Committee

  • Mohamed Abdelmoneum, Intel Corporation
  • Fern Abrams, IPC
  • Bricwe Achkir, Cisco Systems, Inc.
  • Dereje Agonafer, University of Texas at Arlington
  • Kadir Akdere, Intel Corporation
  • Wilfried Bair, Suss Microtec
  • Bahareh Banijamali, Xilinx, Inc.
  • Harrison Beasley, Global Semiconductor Alliance (GSA)
  • Gary Brist, Intel Corp
  • David Cadge, Dassault Systems
  • George Carson, Henkel Electronic Materials
  • Moses Chan, Vitesse Semi
  • Satish Chaparala, Corning Inc.
  • Satya Chinnusamy, Semtech
  • Kathy Cook, Ziptronix
  • William Crockett, Tanaka Denshi
  • Mitul Dalal, MC10 Process Development
  • Craig Davidson, Viasystems Group, Inc.
  • Xuejun Fan, Lamar University
  • Alexander Fang, Aurrion
  • Michael Flint, US Department Of Defense
  • Toru Fujinami, USHIO America
  • Gene Gan, Maxim Integrated Products
  • Muraili Guntu, Guanxi Technology
  • Venkatesh Holalkere, CoolClouds Inc.
  • Happy Holden, Gentex Corporation
  • Jang-Hi Im, The University of Texas at Austin
  • Burkan Kaplan, ASELSAN
  • Nozad Karim, Amkor Technology
  • Rajesh Katkar, Invensas Corp
  • Rory King, IHS Inc.
  • Wei Koh, Pacrim Technology
  • Evstatin Krastev, Nordson Dage
  • Ken Kuang, Torrey Hills Technologies, LLC
  • Raj Kumar, Viasystems Group, Inc.
  • Aswani Kurra, LSI Corporation
  • Wendell Law, Avionics Specialist, Inc.
  • Ming Li, Rambus Inc.
  • Ben Li, Sony Electronics
  • Shawn Liang, Henkel Electronic Materials, LLC
 
  • Jamin Ling, Kullicke and Soff, Inc.
  • Chris Lyons, TOK
  • Hongtao Ma, Bridgelux
  • Mike Ma, SPIL (Siliconware Precision Industries Co. Ltd)
  • Om Mandhana, Cadence Design Systems
  • Kailasnath Maneparambil, Intel Corp.
  • Voya Markovich, Endicott Interconnect Technologies, Inc.
  • Clarisse Mazuir, Philips Lumileds Lighting
  • Mohamed Megahed, Intel Corp.
  • Laurette Nacamulli, The Dow Chemical Company
  • Vinh Nguyen, ECI Technology
  • Reza Paydar, Marvell Semiconductor
  • Raj Pendse, STATS ChipPAC, Inc.
  • Daniel Persico, Kemet Corporation
  • Jeff Platts, Photo Sciences, Inc
  • Stephanie Potisek, The Dow Chemical Company
  • Jeffery Puschell, Raytheon Company
  • Carter Ralph, Southern Research Institute
  • Manish Ranjan, Ultratech Inc.
  • Steve Restivo, Lenovo
  • Joe Ritter, JSR Micro, Inc.
  • Vikram Sekar, Peregrine Semiconductor
  • Reza Sharifi, Broadcom Corporation
  • Jiming Song, Iowa State University
  • Sumant Sood, Suss Microtec
  • Jeff Su, Hitachi Via Mechanics USA
  • Jinbang Tang, Freescale
  • Ed Tinsley, Dell, Inc.
  • Takehiko Tomonaga, USHIO America
  • Dan Tracy, Semi
  • Arun Vaidyanath, Rambus Inc.
  • Mark Vandenbrink, Hewlett-Packard Company
  • Amit Varma, High Connection Density
  • Gary Waissi, ASU College of Innovation
  • Chung-Lin Wu, Fairchild Semiconductor
  • Hong Yang, Entropic Communications
  • Jiro Yota, Skyworks Solutions, Inc.
  • Scott Zerkle, Yamaha Motor Corporation
  • John, Zhiyuan Yang, Peregrine Semiconductor

The program committee includes industry professionals known as leaders and experts in the electronics industry. Members of the program committee take part in attracting abstracts, especially in strategic areas and selecting the papers to be presented at the conference. A Ph.D. with more than three years of industry experience or a B.Sc. with more than eight years of industry experience are required as the minimum requirement for admission to the program committee. The program committee meets regularly by teleconference during the year to put the program together. Attending the conference is expected from all members of the program committee.

Serving in the program committee is an excellent opportunity not only to drive the industry but also to develop professionally even further. Our membership list is continuously growing, making IPC ESTC an event that truly encompasses the industry. If you are interested in joining the program committee, please submit your interest by sending an e-mail to spekin@msn.com. Please include IPC ESTC PROGRAM COMMITTEE as your subject line and your name, title, e-mail, phone, company name, and short bio.

IPC ESTC Program Committee members serve on an honorary basis by volunteering their time and professional skillset. Their views and support do not necessarily represent that of their employers, and their company names are provided for contact purposes only.